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Three-dimensional (3D) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.
Date of Conference: 21-24 Oct. 2001