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Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives

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5 Author(s)
R. J. Gutmann ; Interconnect Focus Center for Gigascale Integration, Rensselaer Polytech. Inst., Troy, NY, USA ; J. Q. Lu ; Y. Kwon ; J. F. McDonald
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Three-dimensional (3D) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.

Published in:

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Date of Conference:

21-24 Oct. 2001