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The study of self-alignment capability of electrically conductive adhesives (ECAs) using low melting point alloy for flip-chip application

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2 Author(s)
C. P. Wong ; Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Kyoung-sik Moon

A feasibility study of the self-alignment capability of electrically conductive adhesives (ECAs) for a flip-chip interconnection application was carried out. The effect of the low melting alloy (LMA) filler on the self-alignment capability of ECAs was investigated. The surface energy of the epoxy resin was studied in terms of the various additives and their loading level using a goniometer with a built-in environmental chamber. The curing profile of the epoxy resin and the melting point of the LMA filler were measured using a differential scanning calorimeter (DSC). The ECAs filled with the LMA over 85 wt% showed self-alignment during the heating process. However, when silver flakes were added to the ECA formulation, self-alignment did not take place. We concluded that the LMA filler depleted into the silver flakes can adversely affect the self-alignment of ECAs. The key parameters required for ECA self-alignment capability are presented. This paper discusses the feasibility of the application of ECA with self-alignment capability for flip-chip interconnection. Initial results from these series studies indicate that incorporation of the LMA into ECAs is an efficient way to make ECAs with self-alignment capability.

Published in:

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Date of Conference:

21-24 Oct. 2001