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Reliability studies of an isotropic electrically conductive adhesive

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4 Author(s)
Morris, J.E. ; Dept. of Electr. & Comput. Eng., Portland State Univ., OR, USA ; Anderssohn, F. ; Kudtarkar, S. ; Loos, E.

ICA reliability continues to be a source of concern for widespread practical implementations in commercial products. In addition, there is still much to be understood in the basic principles of how such materials function. This paper includes contributions in both areas, in further understanding of ICA size effects, in the interpretation of the beneficial effects of vacuum treatments before curing, with additional drop test data, and with critical comments on common electrical test techniques.

Published in:

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Date of Conference:

21-24 Oct. 2001