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3D micro optical switching system (3D-MOSS)-Packaging design

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6 Author(s)
T. Yoshimura ; Tokyo Univ. of Technol., Japan ; G. Tsukada ; S. Kawakami ; Y. Arai
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A packaging design providing "3D micro optical switching system (3D-MOSS)" is expected to reduce waveguide crossing points, system size and wiring distance drastically by using variable well optical integrated circuit (VWOIC)

Published in:

Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE  (Volume:2 )

Date of Conference:

2001