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Analysis of substrate thermal gradient effects on optimal buffer insertion

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3 Author(s)
Ajami, A.H. ; Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA ; Banerjee, K. ; Pedram, M.

Studies the effects of the substrate thermal gradients on the buffer insertion techniques. Using a non-uniform temperature-dependent distributed RC interconnect delay model, the buffer insertion problem is analyzed and design guidelines are provided to ensure the near-optimality of the signal performance in the presence of the thermal gradients. In addition, the effect of temperature-dependent driver resistance on the buffer insertion is studied. Experimental results show that neglecting thermal gradients in the substrate and the interconnect lines can result in non-optimal solutions when using standard buffer insertion techniques and that these effects intensify with technology scaling.

Published in:

Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on

Date of Conference:

4-8 Nov. 2001