Referenced Items are not available for this document.
This paper describes a design methodology to determine the number of chip capacitors needed and its placement scheme for the latest PentiumR III microprocessor package substrate for optimum performance. The effect of capacitors on the power supply and its performance and placement schemes are discussed and compared against measurements. Performance improvements are outlined and compared between the current 0.13 μm and the previous 0.18 μm silicon package technology designed for compatibility with existing systems
Published in:
Electrical Performance of Electronic Packaging, 2001
Date of Conference: 2001
- Page(s):
- 291 - 294
- Meeting Date :
- 29 Oct 2001-31 Oct 2001
- Print ISBN:
- 0-7803-7024-4
- INSPEC Accession Number:
- 7220002
- Conference Location :
- Cambridge, MA
- Digital Object Identifier :
- 10.1109/EPEP.2001.967666
- Product Type:
- Conference Publications
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