Referenced Items are not available for this document.
This paper describes a time-domain scattering method using triangle impulse response for modeling electronic packaging components such as connectors and vias. The method provides a direct data interface for linear component models to time-domain EM/circuit simulation tools
Published in:
Electrical Performance of Electronic Packaging, 2001
Date of Conference: 2001
- Page(s):
- 51 - 54
- Meeting Date :
- 29 Oct 2001-31 Oct 2001
- Print ISBN:
- 0-7803-7024-4
- INSPEC Accession Number:
- 7219945
- Conference Location :
- Cambridge, MA
- Digital Object Identifier :
- 10.1109/EPEP.2001.967609
- Product Type:
- Conference Publications
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