By Topic

Design and manufacturing of a pressure sensor with capacitive readout, CMOS compatible

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Firtat, B. ; Politehnic Univ. of Bucharest, Romania ; Nedelcu, O. ; Moldovan, C. ; Dascalu, D.

A capacitive differential pressure sensor which is CMOS compatible is designed and realized. The device consists of a variable capacitor made by silicon bulk and surface micromachining. The upper electrode is a diaphragm in a sandwich of polyimide and metal. The bottom electrode is placed on a silicon substrate and is formed by Cr/Au deposition. The sensor has a 5 μm air gap as a dielectric. It is made from monocrystalline silicon by means of micromachining methods. It has an area of 800×800 μm and a thickness of about 7 μm. The sensor can be integrated on one chip with a pre-amplifier circuit and is designed and simulated using the MEMCAD 4.8 software. In MEMCAD, we designed the 2D and 3D models, according with the technological manufacturing processes. We simulated the capacitance of the sensor depending on the applied relative pressure. A sensitivity ΔC/C of about 60% is achieved for a differential pressure of 1 atm. The results of the analysis show that the sensor can be used at relative pressures between 0 and 1.6 atm. The scale of pressures can be enlarged easily by increasing the air gap or by changing the thickness of the polyimide diaphragm. The manufacturing of the device is briefly described, but the focus lies primarily on the design and simulation of the sensor

Published in:

Semiconductor Conference, 2001. CAS 2001 Proceedings. International  (Volume:2 )

Date of Conference:

Oct 2001