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A lumped-element physics-based equivalent circuit for differential vias in multilayer parallel plate environments is presented. The TEM parallel plate mode excited by differential vias is quantified by implementing the developed model in a commercial CAD tool. The corresponding CAD simulations are performed in a matter of a few seconds on an Ultra 5 SUN workstation and compare well with Time Domain Reflectometry (TDR) measurements and Finite Difference Time Domain (FDTD) simulations.
Microwave Symposium Digest, 2001 IEEE MTT-S International (Volume:3 )
Date of Conference: 20-24 May 2001