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Analysis of differential vias in a multilayer parallel plate environment using a physics-based CAD model

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3 Author(s)
Abhari, R. ; Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada ; Eleftheriades, G.V. ; van Deventer-Perkins, E.

A lumped-element physics-based equivalent circuit for differential vias in multilayer parallel plate environments is presented. The TEM parallel plate mode excited by differential vias is quantified by implementing the developed model in a commercial CAD tool. The corresponding CAD simulations are performed in a matter of a few seconds on an Ultra 5 SUN workstation and compare well with Time Domain Reflectometry (TDR) measurements and Finite Difference Time Domain (FDTD) simulations.

Published in:

Microwave Symposium Digest, 2001 IEEE MTT-S International  (Volume:3 )

Date of Conference:

20-24 May 2001