Scheduled System Maintenance:
On May 6th, single article purchases and IEEE account management will be unavailable from 8:00 AM - 12:00 PM ET (12:00 - 16:00 UTC). We apologize for the inconvenience.
By Topic

Silicon substrate coupling noise modeling, analysis, and experimental verification for mixed signal integrated circuit design

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Jin, W. ; Dept. of Electr. & Comput. Eng., Hanyang Univ., Ansan, South Korea ; Eo, Y. ; Shim, J.I. ; Eisenstadt, W.R.
more authors

The frequency-variant characteristics of a silicon substrate were physically modeled, analytically investigated, and experimentally verified. The scalable circuit model parameter extraction methodology was newly developed. Thus, the proposed technique can provides the efficient performance evaluations as well as the accurate design guidelines concerned with the complicated mixed signal integrated circuit designs.

Published in:

Microwave Symposium Digest, 2001 IEEE MTT-S International  (Volume:3 )

Date of Conference:

20-24 May 2001