By Topic

Minimum time control of conductive heating systems for microelectronics processing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Tay, A. ; Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore ; Weng Khuen Ho ; Young Peng Poh

A minimum time control scheme is designed to improve repeatability by minimizing the loading effects induced by the common processing condition of placement of a semiconductor wafer at ambient temperature on a large thermal-mass bake plate at processing temperature. The minimum time control strategy provides an optimal solution for minimizing the worst case deviation from a nominal temperature set-point during the load disturbance condition. This results in a predictive controller that performs a predetermined heating sequence prior to the arrival of the wafer as part of the resulting feedforward/feedback strategy to eliminate the load disturbance. The controller is easy to design and implement and makes it more suitable for online implementation such as automatic online tuning of a feedforward controller. Experimental results depict an order-of-magnitude improvement in the settling time and the integral-square temperature error between the optimal predictive controller and a feedback controller for a typical load disturbance

Published in:

Semiconductor Manufacturing, IEEE Transactions on  (Volume:14 ,  Issue: 4 )