By Topic

Development of data logging system for chemical mechanical polishing and its application for process control

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
A. Tanzawa ; Hitachi Tohbu Semicond. Ltd, Japan ; T. Igarashi ; S. Matsuzaki ; T. Suzuki
more authors

Chemical mechanical polishing (CMP) has been available to semiconductor manufacturing but it is still difficult to control the CMP process precisely. This means that it is hard to control CMP according to the process model. Without model based process control, one can't achieve major success. This report describes the development of a data logging network system for CMP process. This system helps engineers building up the proper process control model. This system consists of the following equipment, CMP to which several analog/digital I/O devices were attached, the equipment of film thickness measurement and of scratch measurement, the particle measurement facility, and the infrared thermometer apparatus. All of these compose a local area network

Published in:

Semiconductor Manufacturing Symposium, 2001 IEEE International

Date of Conference:

2001