Cart (Loading....) | Create Account
Close category search window

A Faraday cage isolation structure for substrate crosstalk suppression

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)

We have exploited a recently-developed, through-wafer via technology in silicon to implement a novel Faraday cage scheme for substrate crosstalk suppression in system-on-chip (SOC) applications. The Faraday cage structure consists of a ring of grounded vias encircling sensitive or noisy portions of a chip. The via technology features high aspect ratio, through-wafer holes filled with electroplated Cu and lined with a silicon nitride barrier layer. The new Faraday cage structure has shown crosstalk suppression of 40 dB at 1 GHz and 36 dB at 5 GHz at a distance of 100 /spl mu/m. This is about 10 dB better than any other isolation technique previously reported.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:11 ,  Issue: 10 )

Date of Publication:

Oct. 2001

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.