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Development of a millimeter-wave system-on-a-package utilizing MCM integration

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9 Author(s)
A. Pham ; Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA ; R. Ramachandran ; J. Laskar ; V. Krishnamurthy
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We present the development of a system-on-a-package at millimeter-wave frequencies utilizing a commercially available multichip-module process. This technology has established a platform for integrating multiple components of different material systems to combine digital application-specific integrated circuits (ASICs), radio-frequency integrated circuits, and microelectromechanical devices onto a package. The multilayer polymer thin films also empower the design and fabrication of integral passive devices, including thin-film resistors, filters, and Wilkinson power combiners

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IEEE Transactions on Microwave Theory and Techniques  (Volume:49 ,  Issue: 10 )