By Topic

Hybrid FDTD-SPICE analysis of radiated emission from PCB with integrated circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Nishizawa, A. ; Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan ; Kobidze, G. ; Tanabe, S.

The radiated emission from ground bouncing and transmission lines have been analyzed using the finite difference time domain (FDTD) and SPICE hybrid method. This method can consider both the nonlinear electric characteristics of IC and the distributed parameters of printed circuit boards (PCB). The computed results of the electric field at 3 m from the PCB were validated by the measurements. The hybrid tool allows calculation of the noise spectrum and radiation pattern. Another advantage is that this method can separate the contributions of various noise sources. This analysis tool and methodology is useful to design transmission lines and power/ground planes in PCB

Published in:

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on  (Volume:1 )

Date of Conference:

2001