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A mixture distribution for the wire bonding image

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4 Author(s)
Noor, N.M. ; Diploma Program, Univ. Teknologi, Kuala Lumpur, Malaysia ; Rijal, O.M. ; Badar, O.M. ; Thon, P.Y.

As a measure of quality for wire bonding, the degree of formation of intermetallics between gold ball and aluminium bond pad was estimated. A digital colour circle image of the surface of the gold ball that was attached to the bond pad was obtained. The resultant image had to be modelled by a three component mixture model proposed by Noor, Rijal, Badar and Thon, (see IEEE TENCON 2000, Kuala Lumpur, p.1299-1304, September 2000), but was shown to be a bad fit. We show that digitizing the polygon image in grey level resulted in a simpler image histogram, which could be model by a two-component mixture model. As an additional method of determining cut-off points between the 'humps' in the mixture model, line profiles of the image were studied

Published in:

Signal Processing and its Applications, Sixth International, Symposium on. 2001  (Volume:2 )

Date of Conference:

2001