By Topic

Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Bhusari, D. ; Cypress Semicond., San Jose, CA, USA ; Reed, H.A. ; Wedlake, M. ; Padovani, A.M.
more authors

A method is presented for fabricating micro-air-channel structures encapsulated by a dielectric material using a sacrificial polymer based on polynorbornene (PNB) chemistry. A spin-coated film of PNB was patterned to define the exact geometry of the air-channels using conventional lithographic and etching techniques. The sacrificial polymer was encapsulated with a permanent dielectric material. The composite was then raised to elevated temperatures to produce gaseous products which permeate through the encapsulating material (SiO2 , SiNx or other polymer) leaving behind minimal solid residue. Air-channels integrated with metal interconnections can be formed via a Damascene, or in-lay process. After patterning the sacrificial polymer, copper was electroplated, followed by encapsulation with the dielectric. Various issues pertaining to the processing steps have been investigated and are discussed, such as type of encapsulants, feasible air-channel sizes, and processing conditions. Such air-channel structures are believed to have potential applications in microelectronics, displays, printers, multilevel wiring boards, microscale chemical reactors on a chip, and microelectromechanical devices

Published in:

Microelectromechanical Systems, Journal of  (Volume:10 ,  Issue: 3 )