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Thermal and mechanical characterization of ViaLUXTM 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications

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7 Author(s)
Dunne, R.C. ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Sitaraman, S.K. ; Shijian Luo ; Wong, C.P.
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Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, the processing temperatures and the thermomechanical properties of the dielectric and substrate materials. In this work, a prospective epoxy-based dielectric material for such sequentially built up (SBU) high density-interconnect printed wiring boards (HDI-PWB) is considered. The polymer is a photo-dielectric dry film (PDDF) material called ViaLuxTM 81, which exhibits a complicated curing behavior due to the long lifetime of the cationic photoinitiators generated by ultraviolet (UV) exposure. The objectives of this work are 1) to conduct differential scanning calorimetry (DSC) experiments and develop a cure kinetics model; 2) to develop a cure shrinkage model based on thermal and chemical shrinkage experiments; 3) to determine the thermomechanical properties of partially and fully cured VialuxTM 81 dry film. All of these experimental characterizations are necessary to select suitable process parameters and to obtain a consistent product with the desired physical and mechanical properties

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Components and Packaging Technologies, IEEE Transactions on  (Volume:24 ,  Issue: 3 )