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Efficient and accurate crosstalk prediction via neural net-based topological decomposition of 3-D interconnect

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1 Author(s)
A. A. Ilumoka ; Petit Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

Crosstalk-related issues have become increasingly important with deep submicron downscaling of ICs and wafer scale integration. In today's systems-on-a-chip, the delay through a wire is often greater than the delay through the gate driving it. Furthermore, because of significant parasitic effects, crosstalk between signals on wires can cause major problems. Improved management of the EMI problem is made possible via EDA tools which have the capability of accurately and efficiently modeling electromagnetic interference effects in nanoscale VLSI. However, existing tools are computationally expensive and do not have broad application. The novel methodology proposed in this paper involves topological decomposition of small portions of interconnect (referred to as wirecells) at an extreme level of detail and the creation of parameterized models of these primitive interconnect structures using modular artificial neural networks (MANNs). The technique uses a finite element method program coupled with a circuit simulator and a neural network multi-paradigm prototyping system to produce a library of standard MANN-based wirecell models. It is especially attractive because none of the existing approaches is capable of fully modeling the simultaneous effect on delay and crosstalk of several uncorrelated variables such as interconnect length, width, thickness, separation, metal and insulating medium conductivity and relative permittivity for multiple systems of conductors. The library models derived are used to predict delay noise and crosstalk resulting from interconnect structures embedded in actual analog and digital circuitry

Published in:

IEEE Transactions on Advanced Packaging  (Volume:24 ,  Issue: 3 )