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Design and modeling of compact on-chip transformer/balun using multi-level metal windings for RF integrated circuits

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4 Author(s)
Tao Liang ; Boston Design Center, IBM Microelectron., Lowell, MA, USA ; Gillis, J. ; Wang, D. ; Cooper, P.

A compact integrated balun transformer is analyzed that meets the size demand of highly integrated RFICs for the wireless industry. The design of a balun transformer with 4:1 impedance ratio using multi-level windings significantly reduces the silicon area compared to that occupied by an equivalent planar design. Its application is demonstrated in a highly efficient, linear amplifier design which achieved first pass design success.

Published in:

Radio Frequency Integrated Circuits (RFIC) Symposium, 2001. Digest of Papers. 2001 IEEE

Date of Conference:

20-22 May 2001

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