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Noble high thermal conductivity, low thermal expansion Cu-Cu2O composite base plate technology for power module application

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6 Author(s)
Saito, R. ; Res. Lab., Hitachi Ltd., Ibaraki, Japan ; Kondo, Y. ; Koike, Y. ; Okamoto, K.
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Noble high thermal conductivity and low thermal expansion Cu-Cu2O composite base plate was developed and successfully applied to power modules. Metal matrix composite consists of Cu and Cu oxide was demonstrated to show excellent combination of thermal conductivity and thermal expansion. This noble Cu-Cu2O base plate was applied to power module, and high reliability and high thermal conductivity of the module were confirmed. Anisotropic thermal property of Cu-Cu2O base plate by controlling the microstructure of composite was also demonstrated

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Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on

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