By Topic

A quasi-SOI power MOSFET for radio frequency applications formed by reversed silicon wafer direct bonding

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
S. Matsumoto ; NTT Telecommun. Energy Labs., Kanagawa, Japan ; Y. Hiraoka ; T. Sakai ; T. Yachi
more authors

A quasi-SOI power MOSFET for radio frequency (RF) applications was fabricated by reversed silicon wafer direct bonding (RSDB). Its breakdown voltage was more than twice that of the conventional SOI power MOSFET and its other dc characteristics were almost the same. Its maximum oscillation frequency was about 15% higher than that of the conventional SOI power MOSFET. The power-added efficiency (PAE) of the quasi- SOI power MOSFET was higher than the SOI one. It showed excellent PAE of 68% at a drain bias of 3.6 V

Published in:

IEEE Transactions on Electron Devices  (Volume:48 ,  Issue: 7 )