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Computer-aided thermal management of electronic networks and devices using TLM

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2 Author(s)
Pulko, S.H. ; Hull Univ., UK ; de Cogan, D.

This article reviews the characteristics and current state of development of the transmission-line modelling (TLM) numerical technique in its application to thermal diffusion and related phenomena, within the context of the design of CAD tools for thermal management of devices and board layout

Published in:

Computer-Aided Engineering Journal  (Volume:8 ,  Issue: 3 )