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Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

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6 Author(s)
Se-Young Jang ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea ; Wolf, J. ; Ehrmann, O. ; Gloor, H.
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For the future electronic packaging, a high density and environmentally friendly interconnection technology is urgently needed. This paper suggests a Pb-free electroplated bumping process for high density interconnection. We describe a newly defined eutectic Sn/3.5Ag solder bumping process using an alloy electroplating method and introduce the UBM (Under Bump Metallurgy) study for electroplated Sn/3.5Ag bumps. Four different types of UBM layers were selected and investigated. The bumping process and UBM interface reactions of Sn/3.5Ag were compared with those of Pb/63Sn which is most commonly used as a solder bumping material

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Electronic Components and Technology Conference, 2001. Proceedings., 51st

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