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Development of advanced 3D chip stacking technology with ultra-fine interconnection

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9 Author(s)
Takahashi, K. ; Assoc. of Super-Adv. Electron. Technol., Tsukuba Center Inc., Ibaraki, Japan ; Hoshino, M. ; Yonemura, H. ; Tomisaka, M.
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The development of 3D chip stacking technology with ultra-fine pitch interconnection initiated in 1999, which is a part of “Ultra High-Density Electronic System Integration” project. The development involves the backend of wafer fabrication process, packaging and testing. The extended study revealed possibilities and advantages of 3D chip stacking structure with ultra-fine interconnection

Published in:

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Date of Conference:

2001