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Design and thermo-mechanical analysis of a Dimple-Array Interconnect technique for power semiconductor devices

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3 Author(s)
Wen, S.S. ; Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA ; Huff, D. ; Guo-Quan Lu

A simple wireless-bond interconnect technique, termed Dimple-Array Interconnect (DAI) technique for packaging power devices and modules is presented in this paper. Electrical connections onto the devices are established by soldering arrays of dimples pre-formed on a metal sheet. Preliminary electrical and thermomechanical modeling results on a prototype DAI power module demonstrated potential advantages of this technique to include reduced parasitic noises, improved thermo-mechanical reliability, as well as lowered processing complexity

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Electronic Components and Technology Conference, 2001. Proceedings., 51st

Date of Conference: