Referenced Items are not available for this document.
The electrical models of leadframe plastic CSPs (Chip Scale Packages) for RFICs have been established based on the S-parameter measurement. To evaluate their RF performance, an on-chip 50 ohm microstrip line was housed in a 32-pin BCC (Bump Chip Carrier) package. The insertion and return losses were calculated against frequency and compared to measurement. Excellent agreement has been observed up to 15 GHz. The package acts as a low-pass filter to cause a sharp cut off for the 50 ohm microstrip line operating above a certain frequency, which was predicted successfully from the established package models
Published in:
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Date of Conference: 2001
- Page(s):
- 348 - 352
- Meeting Date :
- 29 May 2001-01 Jun 2001
- ISSN :
- 0569-5503
- Print ISBN:
- 0-7803-7038-4
- INSPEC Accession Number:
- 7049111
- Conference Location :
- Orlando, FL
- Digital Object Identifier :
- 10.1109/ECTC.2001.927747
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
