A full software analysis technique for the radio frequency (RF) plasma display panel (PDP) has been developed. The RF PDP test panel has been analyzed by the segmentation/three-dimensional (3-D) parameter extraction/SPICE simulation scheme, which was originally developed for the analysis of RF complimentary metal oxide semiconductor (CMOS) chips. Our technique is shown to be accurate in predicting the input impedance of the RF port and the calculated input impedance is used to perform impedance matching of the system. The technique is also extendable to a much larger size RF-PDP and has the possibility of being applied to the design and analysis of various interesting RF systems and components
Published in:
Components and Packaging Technologies, IEEE Transactions on
(Volume:24
,
Issue:
2
)
Date of Publication: Jun 2001