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Optimization of plate fin heat sinks using entropy generation minimization

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2 Author(s)
J. R. Culham ; Dept. of Mech. Eng., Waterloo Univ., Ont., Canada ; Y. S. Muzychka

The specification and design of heat sinks for electronic applications is not easily accomplished through the use of conventional thermal analysis tools because “optimized” geometric and boundary conditions are not known a priori. A procedure is presented that allows the simultaneous optimization of heat sink design parameters based on a minimization of the entropy generation associated with heat transfer and fluid friction. All relevant design parameters for plate fin heat sinks, including geometric parameters, heat dissipation, material properties and flow conditions can be simultaneously optimized to characterize a heat sink that minimizes entropy generation and in turn results in a minimum operating temperature. In addition, a novel approach for incorporating forced convection through the specification of a fan curve is integrated into the optimization procedure, providing a link between optimized design parameters and the system operating point. Examples are presented that demonstrate the robust nature of the model for conditions typically found in electronic applications. The model is shown to converge to a unique solution that gives the optimized design conditions for the imposed problem constraints

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:24 ,  Issue: 2 )