By Topic

An improved three-dimensional ray tracing model for mobile communications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Tan, H.S. ; Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore ; Ang, T.W.

This paper presents a novel three-dimensional propagation model for a general environment including building structures with non-planar or curved surfaces. A method to overcome the difficulty of modeling such scatterers with curved surfaces in ray tracing model is presented. The model takes into account all possible propagation paths from any combination of an arbitrary number of reflections, transmissions and diffractions from/through plane surfaces, straight edges as well as curved surfaces. Comparisons between our theoretical results and measured power delay profiles, rms delay spreads and path loss in a microcell containing building structures with curved surfaces show good agreement. Our results show that the inclusion of scattering from curved surfaces has a significant effect on the power delay profile and rms delay spread especially in the shadow regions

Published in:

Microwave Conference, 2000 Asia-Pacific

Date of Conference:

2000