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Packaging using MEMS technologies and planar components

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7 Author(s)
Takahashi, Kazuaki ; Matsushita Electr. Inst. Tokyo Inc., Matsushita Electr. Ind. Co. Ltd., Kawasaki, Japan ; Sangawa, U. ; Fujita, Suguru ; Goho, Kenji
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Three-dimensional millimeter-wave IC applying multi-layer BCB thin film and silicon micromachining technology was developed. Low loss characteristics were achieved by applying micromachining technology, despite being a quasi-planar structure, and a K-band filter was developed. Moreover, manufacture of the receiver front-end with built-in filter integrated into one package was realized by using flip-chip bonding techniques. Furthermore, we proposed an alternative BCB suspended structure and demonstrated a Ka-band antenna for the proposed package

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Microwave Conference, 2000 Asia-Pacific

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