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Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications

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6 Author(s)
Pieters, P. ; MCP/HDIP Group, IMEC, Leuven, Belgium ; Vaesen, K. ; Carchon, G. ; Brebels, S.
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In the current trend towards portable applications, the integration of passive components has become very important. This paper introduces high quality integrated passive components in thin film multilayer MCM-D technology. The main characteristics and modeling issues for use at RF and microwave frequencies are discussed. Also, a number of circuits applicable in wireless front-ends using the integrated passives are presented. These show that MCM-D may be used for the integration of miniature systems for wireless applications

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Microwave Conference, 2000 Asia-Pacific

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