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Statistical bin analysis on wafer probe

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5 Author(s)

In the semiconductor environment, statistical process control (SPC) has been extensively used to assure the quality of each fabrication step. The purpose of this paper is to show why and how the final step in integrated circuit (IC) manufacturing, the results from testing of all chips on each wafer, should be subject to statistical control as a standard operating procedure

Published in:

Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI

Date of Conference:

2001