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Strategy for electromagnetic interconnect modeling

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3 Author(s)
P. Meuris ; IMEC, Leuven, Belgium ; W. Schoenmaker ; W. Magnus

In order to design on-chip interconnect structures in a flexible way, a computer-aided design approach is advocated in three dimensions, describing high-frequency effects such as current redistribution due to the skin effect or eddy currents and the occurrence of slow-wave modes. The electromagnetic environment is described by a scalar electric potential and a magnetic vector potential. These potentials are not uniquely defined and in order to obtain a consistent discretization scheme, a gauge transformation field is introduced. The displacement current is taken into account to describe current redistribution and a small-signal analysis solution scheme is proposed based upon existing techniques for fields in semiconductors

Published in:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems  (Volume:20 ,  Issue: 6 )