By Topic

Novel CMOS compatible frontside micromachining of integrated thermoelectric sensors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Socher, E. ; Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel ; Bochobza-Degani, O. ; Nemirovsky, Y.

CMOS compatible integrated thermoelectric sensors were designed and realized using a standard CMOS process and frontside RIE micromachining. The suspended structures were designed to have a spiral structure that enhances the thermal resistance and isolation of the sensor. Using dry RIE frontside micromachining for the release of the sensors allows better yield in realization of sensitive and smaller sensor pixels. Measured results of sensors used for IR detection show NEP's down to 0.4 nW/ Hz and response times down to 3 msec in 70*70 μm2 pixels

Published in:

Electrical and electronic engineers in israel, 2000. the 21st ieee convention of the

Date of Conference:

2000