By Topic

Ultrasonic inspection of complex geometry component specimen with a smart flexible contact phased array transducer: modeling and application

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Roy, O. ; CEREM, CEA, Centre d'Etudes Nucleaires de Saclay, Gif-sur-Yvette

In many non-destructive testing applications, specimens may exhibit various geometries and state of surface: varying profiles of misaligned specimen, complex and irregular weld shapes. The ultrasonic inspection of such specimens with contact transducer should overcome several major difficulties: degradation of matching contact between the transducer and the specimen leading to a poor sensitivity, disorientation of the transducer resulting in an irrelevant localization of defects, or uncovered scanned area. The French Atomic Energy Commission (CEA) has therefore developed a new concept of transducer, allowing one both to take into account the varying profile of the tested component and to compensate these effects. This transducer is a flexible phased array able to match the surface of the inspected specimen and to efficiently compensate the deformation of its own surface, in order to preserve the ultrasonic beam characteristics in spite of the profile variations encountered during the scanning. The capabilities of this new concept of smart contact probe are described and demonstrated in this paper using modeling and experiments

Published in:

Ultrasonics Symposium, 2000 IEEE  (Volume:1 )

Date of Conference:

Oct 2000