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RF/wireless interconnect for inter- and intra-chip communications

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5 Author(s)
Chang, M.-C.F. ; Dept. of Earth Eng., California Univ., Los Angeles, CA, USA ; Roychowdhury, V.P. ; Liyang Zhang ; Hyunchol Shin
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Recent studies showed that conventional approaches being used to solve problems imposed by hard-wired metal interconnects will eventually encounter fundamental limits and may impede the advance of future ultralarge-scale integrated circuits (ULSls). To surpass these fundamental limits, we introduce a novel RF/wireless interconnect concept for future inter- and intra-ULSI communications. Unlike the traditional “passive” metal interconnect, the “active” RF/wireless interconnect is based on low loss and dispersion-free microwave signal transmission, near-field capacitive coupling, and modem multiple-access algorithms. In this paper we address issues relevant to the signal channeling of the RF/wireless interconnect and discuss its advantages in speed, signal integrity, and channel reconfiguration. The electronic overhead required in the RF/wireless-interconnect system and its compatibility with the future ULSI and MCM (multi-chip-module) will be discussed as well

Published in:

Proceedings of the IEEE  (Volume:89 ,  Issue: 4 )