By Topic

A transient thermal analysis using a simplified heat transfer coefficient model

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Asghari, T.A. ; Integrated Electron. Syst. Sector, Automotive & Ind. Electron. Group, Northbrook, IL, USA

A transient thermal analysis was performed on the Motorola Automotive and Industrial Electronics Group (AIEG) electronic module to determine the maximum temperatures of a bare transistor die during cyclic electrical loading. The Icepak computational fluid dynamics (CFD) software was used to model system level transient thermal behaviour. An initial steady state full CFD model was solved for mass, momentum, and energy based on Navier-Stokes and energy equations using the finite volume method. Heat transfer coefficients were obtained from object surfaces in contact with the convective fluid and plotted as a linear function of wall temperature for various power dissipation levels. A model with a reduced meshed region of 1/6 of the full CFD model was developed. This model incorporates heat transfer coefficients, determined from full CFD steady state runs at various power dissipation levels, as boundary conditions on the walls of the computational domain coincident to the outer surfaces of the solid model and solves only for the energy equation. The heat transfer coefficient is input as a linear function of the wall temperature. The simplified heat transfer coefficient model can be accurately used to solve transient thermal analysis problems for various duty cycles. It reduces computation time by a factor of 10 relative to the full CFD model

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference: