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The depletion/wetting of the low melting point alloy in electrically conductive adhesives (ECAs)

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3 Author(s)
Jiali Wu ; Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Kyoung-Sik Moon ; Wong, C.P.

With the driving force of “green” revolution in electronics industry, tremendous efforts have been put into looking for lead-free alternatives. Although lead-free alloys draw a lot of attention, their parasitic weaknesses, such as high processing temperature and surface tension, limit their application on thermally sensitive, flexible, nonsolderable substrates and ultra-fine pitch size flip chip interconnection. Conventional electrically conductive adhesives (ECAs) have been widely used in surface mount and die-attach technologies for electrical interconnection and heat dissipation. The low processing temperature of ECAs is one of the major advantages over lead-free solders, which brings low system stress, simple manufacturing processes, etc. In order to improve the contact resistance of ECAs, a low melting point alloy (LMA) incorporation technology has been developed by our group. In this paper, the research thrust was concentrated on the LMA depletion method, since re-melting LMA in ECAs can adversely affect the physical properties. A differential scanning calorimeter (DSC) was used for the basic examination of the depletion rate of LMAs in typical ECAs. Cross-sectional morphology, LMA distribution and intermetallic compounds were investigated by scanning electron microscopy

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference:

2001

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