By Topic

Development of no-flow underfill based on non-anhydride curing system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Zhuqing Zhang ; Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Lianhua Fan ; C. P. Wong

Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using a nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties and reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with nonanhydride underfill shows high reliability during the thermal shock test. Using an appropriate fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference: