By Topic

Reliability and Au embrittlement of lead free solders for BGA applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

Pb-free solder for electronics assemblies is fast becoming a reality, primarily because of market driven forces. This affects the entire electronic manufacturing industry, from component supplier to equipment manufacturer. While the industry has identified possible alternates to Sn-Pb solder alloy, much work still needs to be done, especially in the area of component and board level reliability, solder/surface interactions, and assembly process development. The reliability of Pb-free solder joints for BGA applications under temperature cycle conditions for three different packages is compared in this paper. Two Sn-Ag-Cu compositions are considered and their reliability is compared with Sn-Pb alloy. In addition, ball shear testing was performed after 0, 24, 48, 96, 192, 384, and 504 hours of high temperature aging. The results indicate that the solder joint reliability generally improves when Pb-free solder is used; however, the degree of improvement is package dependent. The ball shear data also favors Sn-Ag-Cu alloy over Sn-Pb alloy. The data also indicates that using Sn-Ag-Cu alloy for solder balls can possibly eliminate the Au embrittlement issue, often encountered in BGA type packages with Sn-Pb balls

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference: