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Rapid laser-beam reflowing of Pb-free solder foils

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3 Author(s)
Herbert, F. ; Tech. Univ. Berlin, Germany ; Dorn, L. ; Shrestha, S.

Different demands are claimed concerning the mechanical, thermal, and electrical characteristics of solders and soldered joints. This is due to new operation fields together with processing temperatures up to 200°C. New development and analysis of Pb-free solders with a widespread melting range complies with acute requirements to ensure higher strength and fatigue stability as well as better wetting performance. The aim of the laser-beam processing experiments was to extend the quality of micro soldered joints and metallization systems through grain refining by rapid laser-beam reflow of innovative Pb-free solders. The experimental tests included the structure of the reflowed solder foil, the shear strength and specific diffusion phenomena of soldered joints

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference: