By Topic

Flux/underfill compatibility study for flip-chip manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
T. Yamashita ; Micron Technol. Inc., Boise, ID, USA ; T. Jiang

In flip-chip assembly processing, material compatibility is a key issue determining package quality and reliability. With the advent of no-clean fluxes, the elimination of the flux cleaning process introduced a compatibility concern between the flux residue and the underfill. To address this problem, various different types of fluxes have been introduced, ranging from epoxy fluxes designed to interact with the underfill to a low-residue system leaving almost nothing behind after the soldering process. In this study, the compatibility of various flux types with an underfill was investigated. Data from TGA and TMA revealed thermal and physical properties, such as flux residue amount and melting points. Surface characteristics analyzed through XPS were used in combination with thermal, chemical, and physical analysis to characterize the behavior of each material set. The advantages and disadvantages of the various flux systems were analyzed through these tests

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference: