By Topic

VIA/BGA/sup (R)/: a low-cost, high-performance packaging technology for broadband telecommunications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Panicker, M.P.R. ; Micro Substrates Corp., Tempe, AZ, USA ; Hyslop, M.S. ; Nelson, S. ; Mongia, R.
more authors

A ceramic BGA packaging technology for broadband applications such as LMDS and SONET/SDH is described. The package is designed for the bandwidth of DC-32 GHz. Manufactured on VIA/PLANE/sup (R)/ using semiconductor processing techniques in an array format, it provides the ability to assemble and test the devices in arrays for maximum productivity. The paper describes the electromagnetic modeling, design, manufacture and testing of the package. Its electrical performance is compared with the theoretical model. The thermal model of the package with device on PCB is also presented. The package attributes are compared with the conventional leaded, microstrip/stripline and leadless formats.

Published in:

Emerging Technologies Symposium: Broadband, Wireless Internet Access, 2000 IEEE

Date of Conference:

10-11 April 2000