By Topic

Wide-bandwidth millimeter-wave bond-wire interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Budka, T.P. ; M/A COM Res. & Dev., Lowell, MA, USA

A new type of interconnect has been developed that significantly extends the bandwidth of fixed-length bond-wire interconnects between microwave circuits. This interconnect maximizes bond-wire length, as well as landing pad size while simultaneously extending the cutoff frequency of the interconnect. The bond-wire interconnect is treated as a five-stage low-pass filter where basic filter theory is used to develop an interconnect prototype. Microstrip interconnects are designed using electromagnetic simulators, which match a specific low-pass filter response on a 5-mil thick (127 μm) glass substrates. The measurements indicate a return loss greater than 12 dB and an insertion loss from 0.0 to 0.3 dB from DC to 80 GHz using two 17-mil-long (432 μm) 1-mil-diameter (25 μm) ball bonds with a tolerance of ±2 mil (50 μm). For comparison, an uncompensated interconnect with two 17-mil-long (432 μm) bond wires has 1-dB insertion loss and 10-dB return loss at 40 GHz and continues to degrade at higher frequencies

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:49 ,  Issue: 4 )