An integrated micro cooling system for electronic circuits

A fully FR4-compatible integrated cooling system has been developed. Cooling channels have been etched into a thick copper layer to form microchannels. The structure is reinforced by two prepreg layers toward the component and solder side. Several cooling channels can be independently run. The heat dissipation capability of the system is 20 W per channel (and heat source). Typical coolants are water or methoxynonafluorobutane. For an outlet to inlet temperature difference of 25/spl deg/C and a power dissipation of 30 W, a (water) flow rate of 20 ml/min is required. Pressure losses are below 300 mbar (for water).