By Topic

Room-temperature testing for high critical-current-density Josephson junctions

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
O'Hara, M.J. ; Lincoln Lab., MIT, Lexington, MA, USA ; Berggren, K.K.

This paper demonstrates that room-temperature resistance measurements can accurately predict the critical current and normal resistance of high critical-current-density junctions. We fabricated high critical-current-density (/spl sim/200 /spl mu/A//spl mu/m/sup 2/=20 kA/cm/sup 2/) Nb/Al/AlO/sub x//Nb Josephson junctions in cross-bridge Kelvin resistor (CBKR) test structures and measured their electrical characteristics both at 4.2 K and at room temperature. We developed a two-dimensional mathematical model of the CBKR test structure with two resistive wiring layers in order to characterize the effect of current crowding on the room-temperature measurements. We then used the model to remove the effect of current crowding from the room-temperature measurements and correlated the values of these measurements to the electrical properties of the junctions at 4.2 K. We also identified test-structure-design rules that guarantee current crowding is negligible.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:10 ,  Issue: 4 )