By Topic

3-D assembly interposer technology for next-generation integrated systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
K. Ohsawa ; North Corp., Tokyo, Japan ; H. Odaira ; M. Ohsawa ; S. Hirade
more authors

Interposers are responsible for 40% of total packaging costs, excluding measurement and testing. With two-layer wiring, this ratio rises to 70%. This interposer uses a simple, two-metal process for low cost. The article shows a sub-materials cost comparison between this interposer and a conventional 2-metal interposer. With this interposer, cost savings are 50%. This is done by eliminating costly laser drilling, via metalization, and ball mounting processes, replacing high-priced photosensitive polyimide with an inexpensive insulator, and by this production system.

Published in:

Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International

Date of Conference:

7-7 Feb. 2001