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A probabilistic-physics-of-failure/short-time-test approach to reliability assurance for high-performance chips: models for deep-submicron transistors and optical interconnects

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6 Author(s)
A. Haggag ; Dept. of Phys., Illinois Univ., Urbana, IL, USA ; W. McMahon ; K. Hess ; K. Cheng
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This paper deviates from strictly empirical chip reliability approaches and uses instead a chip reliability methodology based on probabilistic-physics-of-failure (PPoF) principles. We derive the failure-time distribution of both deep-submicron transistors and optical interconnects owing to the presence of a common defect activation energy distribution. We show how short-time device degradation can be used to extract the tails of the semi-symmetric failure-time distribution (important for long-term reliability qualification). Applying novel reliability qualification rules based on this failure-time distribution, “latent failures” can then be avoided through design changes for reliability

Published in:

Integrated Reliability Workshop Final Report, 2000 IEEE International

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