By Topic

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Fan, X.-J. ; Phillips Res., Briarcliff Manor, NY, USA ; Wang, H.B. ; Lim, T.B.

In this paper, stress singularity in electronic packaging is described and three general cases are summarized. The characteristics of each stress singularity are briefed. In order to predict the likelihood of delamination at a bimaterial wedge, where two interfaces are involved, a criterion is proposed and the corresponding parameters are defined. The propagation of a crack inside a homogeneous material with the effects of delamination and stress singularity is predicted by the maximum hoop stress criterion. The proposed criteria are adopted in the analysis of a flip-chip with underfill under thermal cyclic loading. A finite element (FE) model for the package is built and the proper procedures in processing FE data are described. The proposed criterion can correctly predict the interface where delamination is more likely to occur. It can be seen that the opening stress intensity factor along the interface (or peeling stress) plays a very important role in causing interfacial failure. The analytical results are compared with experimental ones and good agreement is found. The effects of delamination and cracking inside the package on the solder balls are also mentioned. Further investigation into the fatigue model of the underfilled solder ball is discussed

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:24 ,  Issue: 1 )